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- Dynamatic Technologies partners with Aequs for Airbus A220 door components
- Runaya and Eckart forge alliance to establish sustainable aluminium powder facility in India
- RRP Electronics and AMB Taiwan forge partnership to drive advanced memory module production
Government to streamline IP processes
Published : 26, Oct 2017
Pendency in Patent examination to be brought down from 7 years to 18 months by 2019
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