Tessolve, a Hero Electronix venture and a leading provider of semiconductor engineering solutions for cutting-edge chips, announced the signing of a definitive agreement to acquire 100 per cent of Dream Chip Technologies, a semiconductor chip design firm headquartered in Germany, for a consideration of up to Rs 400 crore (EUR 42.5 million). The agreement is subject to regulatory approvals.
This acquisition positions Tessolve among a select group of design firms worldwide capable of delivering turnkey design solutions for complex, cutting-edge chips. It further strengthens Tessolve's industry leadership by adding advanced capabilities in System on Chip (SoC) designs for the artificial intelligence (AI), automotive, data centre, and industrial markets. The acquisition will also expand Tessolve's European operations, adding four delivery locations across Germany and the Netherlands, including a specialised ADAS and imaging centre-of-excellence lab. This move reinforces Tessolve's commitment to providing cutting-edge semiconductor and embedded design solutions while expanding its market share in the semiconductor services sector.
"This acquisition solidifies our position as a top-tier semiconductor engineering firm globally, with unmatched design-to-productisation capabilities," said Srini Chinamilli, Co-founder & CEO of Tessolve. "Dream Chip's capabilities further strengthen our ability to take on leading-edge ASIC design projects and greatly enhance our European footprint," he added.
Headquartered in Germany, Dream Chip Technologies has a highly capable team of specialised engineers and solution architects and is recognised as one of the region's leading semiconductor design service companies, particularly for its expertise in complex digital designs. Its chip architecture and front-end design capabilities, combined with Tessolve's strengths in chip design and excellence in post-silicon test and packaging design, will enhance the company's ability to deliver full-chip turnkey design solutions from specification to volume silicon production, thereby providing critical "time-to-market" and "operational excellence" advantages to customers. The acquisition is a 100 per cent cash transaction.
"We are excited to join forces with Tessolve and bring our expertise in digital chip design and embedded software to a global platform. By combining our design capabilities and IP with Tessolve's established semiconductor services and embedded solutions, we can offer our customers a truly end-to-end solution, from chip architecture to post-silicon test and supply chain management, for their most complex designs," said Jens Benndorf, CEO of Dream Chip Technologies. "Together, we will push the boundaries of innovation in automotive and enterprise designs, particularly in camera-based systems and AI-driven ASIC applications," he added.
Ujjwal Munjal, Chairman of Tessolve, remarked, "Over the past few years, Tessolve has demonstrated impressive growth and resilience. With the synergy brought by Dream Chip Technologies, I am confident that Tessolve is poised to become a world leader in this space with unparalleled capabilities. As major companies increasingly shift towards custom chip design, this acquisition positions Tessolve more strongly than ever to meet the growing demands of the custom chip market."
