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Toshiba fabrication facility coming up at Yokkaichi, Japan

By Niranjan Mudholkar,

Added 13 February 2017

Memory R&D Center will also be at same location

Artist's impression of Fab 6, Yokkaichi Operations (Graphic: Business Wire)

Toshiba Corporation (TOKYO:6502) has announced that it has started construction of a new state-of-the-art semiconductor fabrication facility, Fab 6, and a new R&D center, the Memory R&D Center, at Yokkaichi Operations in Mie prefecture, Japan, the company's main memory production base.

Fab 6 will be dedicated to production of BiCS FLASH (trademark of Toshiba Corporation), Toshiba's innovative 3D Flash memory1. Like Fab 5, construction will take place in two phases, allowing the pace of investment to be optimized against market trends, with completion of Phase 1 scheduled for summer 2018. Toshiba will determine installed capacity and output targets and schedules by closely monitoring the market.

Toshiba will also construct a Memory R&D Center adjacent to the new fab, with completion targeting December 2017. The facility will advance development of BiCS FLASH™ and new memories.

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