RRP Electronics Limited, a leading name in the semiconductor industry, has signed a Memorandum of Understanding (MoU) with AMB, Taiwan, to drive the production of advanced memory modules, including SPI NAND, MICROSD, eMMC, and SSD technologies. This strategic collaboration is projected to generate an annual revenue of $25 million, representing a significant milestone in the global semiconductor landscape.

The agreement includes comprehensive technology sharing, covering package structure details, substrate designs, test program development, and tool design support. With extended capacities starting from 2 GB onwards, the advanced memory solutions aim to meet the increasing global demand in the electronics market.

Commenting on the partnership, Rajendra Chodankar, Chairman of RRP Electronics Limited, stated: "RRP Electronics is delighted to collaborate with AMB, Taiwan. By leveraging cutting-edge technology at our state-of-the-art OSAT facility, we are positioned to serve industry giants like Samsung and other key players. This partnership not only paves the way for $25 million in annual revenue but also strengthens our position as a global leader in semiconductor innovation."

Production will take place at RRP Electronics' 40,000 sq. ft. OSAT (Outsourced Semiconductor Assembly and Test) facility in Mahape, which became operational in September 2024. To meet growing demand, the company is expanding its manufacturing capacity with new production lines at its forthcoming plant in MIDC, Taloja, slated to begin operations within the next two years.